兑水 发表于 2009-10-4 08:29:36

ASTM D 3004-2002 挤压热固和热塑的半导体和绝缘屏蔽的标准规范

D3004-02 Standard Specification for Extruded Crosslinked and Thermoplastic Semi-Conducting, Conductor and Insulation Shielding Materials
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