兑水 发表于 2009-10-21 15:55:39

ASTM D 6095-2006 挤压成型、交联的和热塑性半导体和绝缘屏蔽...

D6095-99 Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
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